Electronic device including cable supporting structure

ABSTRACT

An electronic device is provided which includes a printed circuit board (PCB) including a non-conductive layer that forms at least a portion of a first surface, and a conductive layer arranged between the first surface and a second surface, an electronic component arranged on a first area of the first surface of the PCB, a conductive shield structure arranged on the PCB to cover the first area and the electronic component on the PCB, a support structure connected to the PCB and including a first part that faces a portion of one side of the conductive shield structure, and a cable extending along the one side of the conductive shield structure, inserted between the support structure and the portion of the one side of the conductive shield structure, and including at least one conductive line and an insulation layer that covers the at least one conductive line.

PRIORITY

This application claims priority under 35 U.S.C. 119(a) to Korean PatentApplication Serial No. 10-2015-0173304, which was filed on Dec. 7, 2015,in the Korean Intellectual Property Office, the entire disclosure ofwhich is incorporated herein by reference.

BACKGROUND

1. Field of the Disclosure

The present disclosure generally relates to an electronic deviceincluding a structure that supports a cable on a printed circuit board(PCB).

2. Description of the Related Art

A plurality of electric contact units that are separated from oneanother may be provided on a printed circuit board (PCB) of anelectronic device. The electric contact units may be connected to eachother by a conductive pattern on the PCB. In this case, degrees offreedom with respect to installation of a signal line for electricalconnection of a plurality of electronic components mounted on the PCBmay be degraded due to the conductive pattern. Therefore, the separatedelectric contact units may be connected to one another via a cable.

For example, various sorts of antennas are required for mobile devices,and the antennas may be electrically connected to each other via acable. In this case, a clip for fixing the cable to the PCB andsupporting the cable may be used. The clip may be mounted on the PCB.

As electronic devices become more compact, printed circuit boards (PCBs)accommodated within the electronic devices are becoming compact andintegrated. To mount a clip on a PCB, a substantial mounting area inwhich not only a mounting area of the clip but also distances betweenthe clip and peripheral components are reflected is necessary, and thusit is difficult to apply the clip to such a compact PCB.

SUMMARY

An aspect of the present disclosure provides supporting structurescapable of reducing a mounting space for a clip for supporting a cable.

According to an aspect of the present disclosure, an electronic deviceis provided which includes a housing, a printed circuit board (PCB)included in the housing, and including a first surface, a second surfaceon a side of the PCB opposite to the first surface, a lateral surface, anon-conductive layer that is at least a portion of the first surface,and a conductive layer arranged between the first surface and the secondsurface, an electronic component arranged on a first area of the firstsurface of the PCB, a conductive shield structure arranged on the PCB tocover the first area and the electronic component on the PCB, as viewedfrom above the first surface of the PCB, a support structure connectedto the PCB, and including a first part that extends substantiallyperpendicular to the first surface and faces a portion of one side ofthe conductive shield structure at a certain distance as viewed fromabove the first surface of the PCB, and a cable extending along the oneside of the conductive shield structure as viewed from above the firstsurface of the PCB, inserted between the support structure and theportion of the one side of the conductive shield structure, andincluding at least one conductive line and an insulation layer thatcovers the at least one conductive line.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects and features of the present disclosure willbecome apparent to those skilled in the art from the following detaileddescription when taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a schematic block diagram of an electronic device within anetwork environment, according to an embodiment of the presentdisclosure;

FIG. 2 is a schematic block diagram of an electronic device according toan embodiment of the present disclosure;

FIG. 3 is a schematic block diagram of a programming module according toan embodiment of the present disclosure;

FIG. 4 is a schematic view of an electronic device according to anembodiment of the present disclosure;

FIG. 5 is a cross-sectional view of a cable according to an embodimentof the present disclosure;

FIG. 6 is a perspective view of a structure for fixing a cable using asupport member and a conductive shield, according to an embodiment ofthe present disclosure;

FIG. 7 is a sectional view taken along line A-A′ in FIG. 6, according toan embodiment of the present disclosure;

FIG. 8 is a perspective view illustrating an aperture of a conductiveshield, according to an embodiment of the present disclosure;

FIG. 9 is a partial plan view of a mounting area of a printed circuitboard (PCB), according to an embodiment of the present disclosure;

FIG. 10 is a cross-sectional view taken along line B-B′ in FIG. 9,according to an embodiment of the present disclosure;

FIG. 11 schematically illustrates a surface mounting method when each ofthe conductive shields of FIGS. 4-7 is used, according to an embodimentof the present disclosure;

FIG. 12 is a schematic view of an electronic device according to anotherembodiment of the present disclosure;

FIG. 13 is a partially exploded perspective view of a conductive shieldaccording to an embodiment of the present disclosure;

FIG. 14 is a cross-sectional view taken along line C-C′ in FIG. 13,according to an embodiment of the present disclosure;

FIG. 15 is a partially exploded perspective view of a conductive shieldaccording to an embodiment of the present disclosure;

FIG. 16 is a partially exploded perspective view of a conductive shieldaccording to another embodiment of the present disclosure;

FIG. 17 schematically illustrates a surface mounting method when each ofthe conductive shields of FIGS. 13-16 is used, according to anembodiment of the present disclosure;

FIG. 18 is a perspective view of a structure for fixing a cable by usinga support member and a conductive shield, according to an embodiment ofthe present disclosure;

FIG. 19 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according toanother embodiment of the present disclosure;

FIG. 20 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according toanother embodiment of the present disclosure;

FIG. 21 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according toanother embodiment of the present disclosure;

FIG. 22 is a schematic cross-sectional view of a cable according to anembodiment of the present disclosure; and

FIG. 23 is a perspective view of a support member according to anembodiment of the present disclosure.

DETAILED DESCRIPTION

Various embodiments of the present disclosure will now be described indetail with reference to the accompanying drawings. In the followingdescription, specific details such as detailed configuration andcomponents are provided to assist in the overall understanding of theembodiments of the present disclosure. Therefore, it should be apparentto those skilled in the art that various changes and modifications ofthe embodiments described herein may be made without departing from thescope and spirit of the present disclosure. In the accompanyingdrawings, like reference numerals may refer to like elements.

Herein, expressions such as “having,” “may have,” “comprising,” and “maycomprise” indicate the existence of a corresponding characteristic(e.g., an element such as a numerical value, function, operation, and/orcomponent) and do not exclude the existence of an additionalcharacteristic.

Herein, expressions such as “A or B,” “at least one of A or/and B,” and“one or more of A or/and B” may include all possible combinations oftogether listed items. For example, these expressions may indicate (1)including at least one A, (2) including at least one B, or (3) includingboth at least one A and at least one B.

Expressions such as “first,” “second,” “primarily,” and “secondary,” mayrepresent various elements regardless of order and/or importance, and donot limit corresponding elements. These expressions may be used fordistinguishing one element from another element. For example, a firstuser device and a second user device may represent different userdevices, regardless of order or importance. For example, a first elementcould be referred to as a second element without deviating from thescope of the present embodiments, and similarly, a second element may bereferred to as a first element.

When an element (e.g., a first element) is “operatively orcommunicatively coupled to” or “connected to” another element (e.g., asecond element), the first element may be directly connected to thesecond element or a third element may exist therebetween. However, whenthe first element is “directly connected to” or “directly coupled to”the second element, no intermediate element exists therebetween.

The expression “configured to (or set to)” may be used interchangeablywith, for example, “suitable for,” “having the capacity to,” “designedto,” “adapted to,” “made to,” or “capable of” according to context.Further, “configured to (or set to)” does not necessarily mean“specifically designed to” by hardware. For example, an “apparatusconfigured to” may indicate that the apparatus may operate with anotherapparatus or component. For example, “a processor configured (or set) toperform A, B, and C” may be a dedicated processor (such as an embeddedprocessor) for performing a corresponding operation, or ageneral-purpose processor (such as a central processing unit (CPU) or anapplication processor (AP)) that may execute at least one softwareprogram stored in a memory device to perform a corresponding operation.

Terms defined herein are used for only describing a specific embodimentand do not limit the scope of other embodiments. A singular form mayinclude a plurality of forms unless explicitly represented as such. Allterms, including technical and scientific terms, used herein may havethe same meanings as would be generally understood by a person of commonskill in the art. Terms that are defined in a dictionary have the sameor similar meanings as would be understood in the related technology andare not to be interpreted as having ideal or excessively formal meaningsunless explicitly defined as such. In some cases, terms defined hereincannot be interpreted to exclude the present embodiments.

An electronic device according an embodiment of the present disclosuremay include at least one of, for example, a smartphone, a tabletpersonal computer (PC), a mobile phone, an image phone, an e-bookreader, a desktop PC, a laptop PC, a netbook computer, a workstation, aserver, a personal digital assistant (PDA), a portable multimedia player(PMP), an MP3 player, a mobile medical apparatus, a camera, or awearable device. For example, the wearable device may include at leastone of an accessory type device (e.g., a watch, a ring, a bracelet, ananklet, a necklace, eyeglasses, contact lenses, or head-mounted-device(HMD)), a fabric or clothing-integrated type device (e.g., electronicclothing), a body-attached type device (e.g., a skin pad or tattoo), ora body-implanted type device (e.g., an implantable circuit).

The electronic device may also be a smart home appliance, such as atelevision (TV), a digital video disk (DVD) player, audio equipment, arefrigerator, an air conditioner, a vacuum cleaner, an oven, a microwaveoven, a washing machine, an air cleaner, a set-top box, a homeautomation control panel, a security control panel, a TV box (e.g.,Samsung HomeSync®, Apple TV®, or Google TV®), a game console (e.g.,Xbox® or PlayStation®), an electronic dictionary, an electronic key, acamcorder, and an electronic frame.

The electronic device may also include at least one of various medicalequipment (e.g., various portable medical measurement systems, such as ablood sugar measurement device, a heartbeat measurement device, a bloodpressure measurement device, or a body temperature measurement device, amagnetic resonance angiography (MRA) device, a magnetic resonanceimaging (MRI) device, a computed tomography (CT) device, an imagingdevice, or an ultrasonic device), a navigation system, a globalnavigation satellite system (GNSS), an event data recorder (EDR), aflight data recorder (FDR), a vehicle infotainment device, electronicequipment for ships (e.g., navigation system and gyro compass forships), avionics, a security device, a vehicle head unit, an industrialor home robot, an automatic teller machine (ATM), a point of sales (POS)terminal, or Internet of things (IoT) devices (e.g., light bulbs,various sensors, electricity or gas meters, sprinkler devices, firealarm devices, thermostats, streetlights, toasters, exercise machines,hot-water tanks, heaters, boilers, etc.).

The electronic device may also include at least one of a part of afurniture or building/structure, an electronic board, an electronicsignature receiving device, a projector, or various measuringinstruments (e.g., a water, electricity, gas, or electric wave measuringdevice). The electronic device may also be a combination of theabove-listed devices. The electronic device may also be a flexibleelectronic device. The electronic device is not limited to theabove-listed devices and may include new electronic devices according tonew technical developments.

An electronic device according to an embodiment of the presentdisclosure will now be described with reference to the accompanyingdrawings. Herein, the term “user” may refer to a person who uses theelectronic device or a device (e.g., an artificial intelligenceelectronic device) using the electronic device.

FIG. 1 illustrates an electronic device 101 in a network environment100, according to an embodiment of the present disclosure. Referring toFIG. 1, the electronic device 101 includes a bus 110, a processor 120, amemory 130, an input/output (I/O) interface 150, a display 160, and acommunication module 170. Alternatively, the electronic device 101 mayomit at least one of the foregoing elements and/or may further includeother elements.

The bus 110 may include a circuit for interconnecting the elements 110through 170 and for allowing communication (e.g., a control messageand/or data) between the elements 110 through 170.

The processor 120 may include one or more of a CPU, an AP, and acommunication processor (CP). The processor 120 performs operations ordata processing for control and/or communication of, for example, atleast one other elements of the electronic device 101.

The memory 130 may include a volatile and/or nonvolatile memory. Thememory 130 may store, for example, commands or data associated with atleast one other elements of the electronic device 101. The memory 130may store software and/or a program 140.

The program 140 includes a kernel 141, middleware 143, an applicationprogramming interface (API) 145, and an application program (or anapplication) 147. At least some of the kernel 141, the middleware 143,and the API 145 may be referred to as an operating system (OS).

The I/O interface 150 delivers a command or data input from a user oranother external device to other element(s) of the electronic device101. The I/O interface 150 may also output a command or data receivedfrom other element(s) of the electronic device 101 to a user or anotherexternal device.

The display 160 may include a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic light emitting diode (OLED)display, a microelectromechanical system (MEMS) display, or anelectronic paper display. The display 160 may display various content(e.g., a text, an image, video, an icon, or a symbol) to users. Thedisplay 160 may also include a touch screen, which receives a touch, agesture, proximity, and/or a hovering input, for example, from anelectronic pen or a part of a body of a user.

The communication module 170 sets up communication, for example, betweenthe electronic device 101 and a first external electronic device 102, asecond external electronic device 104, and/or a server 105. Thecommunication module 170 is connected to a network 162 through wirelessor wired communication to communicate with the second externalelectronic device 104 and/or the server 105.

The wireless communication may use, as a cellular communicationprotocol, at least one of long term evolution (LTE), LTE-advanced(LTE-A), code division multiple access (CDMA), wideband CDMA (WCDMA), auniversal mobile telecommunication system (UMTS), wireless broadband(WiBro), or global system for mobile communications (GSM). Wirelesscommunication also includes short-range communication 164. Theshort-range communication 164 may include at least one of wirelessfidelity (WiFi), Bluetooth (BT), near field communication (NFC), orglobal navigation satellite system (GNSS). The GNSS may include at leastone of a global positioning system (GPS), a global navigation satellitesystem (Glonass), a Beidou navigation satellite system (Beidou), orGalileo, the European global satellite-based navigation system. Herein,the term “GPS” may be used interchangeably with the term “GNSS”. Thewired communication may include at least one of a universal serial bus(USB), a high definition multimedia interface (HDMI), a recommendedstandard (RS)-2032, or a plain old telephone service (POTS). The network162 may include a telecommunications network, for example, at least oneof a computer network (e.g., a local area network (LAN) or a wide areanetwork (WAN)), Internet, and a telephone network.

Each of the first external electronic device 102 and the second externalelectronic device 104 may be the same type or a different type of devicethan the electronic device 101. The server 105 may include a group ofone or more servers. All or some of operations performed in theelectronic device 101 may be performed in the electronic device 102, theelectronic device 104, and/or the server 105. For example, when theelectronic device 101 has to perform a function or a service, theelectronic device 101 may request the electronic devices 102 and 104,and/or the server 105 to perform at least some functions associated withthe function or the service, instead of or in addition to executing thefunction or the service itself. The electronic devices 102 and 104and/or the server 105 may perform the requested function or anadditional function and deliver the result to the electronic device 101.The electronic device 101 provides the received result without changes,or provides the requested function or service by processing the receivedresult. For example, cloud computing, distributed computing, orclient-server computing may be used.

FIG. 2 is a block diagram of an electronic device 201 according to anembodiment of the present disclosure. The electronic device 201 mayinclude, for example, the whole or a portion of the electronic device101 of FIG. 1. Referring to FIG. 2, the electronic device 201 includes aprocessor 210 (e.g., an AP), a communication module 220, a subscriberidentification module (SIM) 224, a memory 230, a sensor module 240, aninput device 250, a display 260, an interface 270, an audio module 280,a camera module 291, a power management module 295, a battery 296, anindicator 297, and a motor 298.

The processor 210 controls multiple hardware or software componentsconnected to the processor 210 by driving an OS or an applicationprogram, and performs a variety of data processing and operations. Theprocessor 210 may be implemented using a system on chip (SoC). Theprocessor 210 may further include a graphic processing unit (GPU) and/oran image signal processor. The processor 210 may also include at leastsome (e.g., a cellular module 221) of the elements illustrated in FIG.2. The processor 210 loads a command or data received from at least oneof other elements (e.g., a non-volatile memory) into a volatile memoryand processes the command or data and stores various data in thenon-volatile memory.

The communication module 220 may have a configuration that is the sameas or similar to the communication module 170 illustrated in FIG. 1. Thecommunication module 220 includes the cellular module 221, a WiFi module223, a BT module 225, a GNSS module (e.g., a GPS module, a Glonassmodule, a Beidou module, or a Galileo module) 227, an NFC module 228,and a radio frequency (RF) module 229.

The memory 230 (e.g., the memory 130) includes an internal memory 232 oran external memory 234. The internal memory 232 may include at least oneof a volatile memory (e.g., dynamic random access memory (DRAM), staticRAM (SRAM), or synchronous dynamic RAM (SDRAM)), and a non-volatilememory (e.g., one time programmable read only memory (OTPROM),programmable ROM (PROM), erasable and programmable ROM (EPROM),electrically erasable and programmable ROM (EEPROM), mask ROM, flashROM, NAND flash memory, NOR flash memory, a hard drive, or a solid statedrive (SSD)).

The external memory 234 may further include a flash drive (e.g., acompact flash (CF), a secure digital (SD), a micro-SD, a mini-SD, anextreme digital (xD), a multimedia card (MMC), or a memory stick). Theexternal memory 234 may be functionally and/or physically connected withthe electronic device 201 through various interfaces.

The sensor module 240 measures physical quantity or senses an operationstate of the electronic device 201 to convert the measured or sensedinformation into an electric signal. The sensor module 240 includes atleast one of a gesture sensor 240A, a gyro sensor 240B, a pressuresensor 240C, a magnetic sensor 240D, an acceleration sensor 240E, a gripsensor 240F, a proximity sensor 240G, a color sensor 240H (e.g., RGBsensor), a biometric sensor 240I, a temperature/humidity sensor 240J, anillumination sensor 240K, and an ultraviolet (UV) sensor 240M. Thesensor module 240 may further include a control circuit for controllingat least one sensor included therein. Alternatively, the electronicdevice 201 may also include a processor configured to control the sensormodule 240 as part of or separately from the processor 210, to controlthe sensor module 240 during a sleep state of the processor 210.

The input device 250 includes a touch panel 252, a (digital) pen sensor254, a key 256, and an ultrasonic input device 258. The touch panel 252may use at least one of a capacitive type, a resistive type, an infrared(IR) type, or an ultrasonic type. The touch panel 252 may furtherinclude a control circuit. The touch panel 252 may further include atactile layer to provide tactile reaction to the user.

The (digital) pen sensor 254 may include a recognition sheet which is apart of the touch panel 252 or a separate recognition sheet. The key 256may also include a physical button, an optical key, or a keypad. Theultrasonic input device 258 senses ultrasonic waves generated in aninput means for generating the ultrasonic waves through a microphone 288and checks data corresponding to the sensed ultrasonic waves in theelectronic device 201.

The display 260 (e.g., the display 160) includes a panel 262, a hologramdevice 264, and a projector 266. The panel 262 may have a configurationthat is the same as or similar to the display 160 illustrated in FIG. 1.The panel 262 may be implemented to be flexible, transparent, and/orwearable. The panel 262 may be configured with the touch panel 252 inone module.

The interface 270 includes a high-definition multimedia interface (HDMI)272, a universal serial bus (USB) 274, an optical interface 276, and aD-subminiature 278.

The audio module 280 bi-directionally converts sound and an electricsignal. At least some of the elements of the audio module 280 may beincluded in the I/O interface 150 illustrated in FIG. 1. The audiomodule 280 processes sound information that is input or output through aspeaker 282, a receiver 284, an earphone 286, and/or the microphone 288.

The camera module 291 captures a still image or a moving image, and mayinclude one or more image sensors (e.g., a front sensor or a rearsensor), a lens, an image signal processor (ISP), or a flash (e.g., anLED or a xenon lamp).

The power management module 295 manages power of the electronic device201. The power management module 295 may include a power managementintegrated circuit (PMIC), a charger IC, and/or a battery gauge. ThePMIC may have a wired and/or wireless charging scheme. The battery gaugemeasures the remaining capacity of the battery 296 or the voltage,current, or temperature of the battery 296 during charging.

The indicator 297 displays a particular state, for example, a bootingstate, a message state, or a charging state, of the electronic device201 or a part (e.g., the processor 210) thereof. The motor 298 convertsan electric signal into mechanical vibration or generates vibration or ahaptic effect.

Each of the foregoing elements described herein may include one or morecomponents, and a name of the component may vary with a type of theelectronic device 201. Alternatively, the electronic device 201 mayinclude at least one of the foregoing elements, and some of the elementsmay be omitted therefrom or other elements may be further includedtherein. As some of the elements of the electronic device 201 arecoupled into one entity, the same function as those of the elements thathave not been coupled may be performed.

FIG. 3 is a block diagram of a programming module 310 according to anembodiment of the present disclosure. Referring to FIG. 3, theprogramming module 310 (e.g., the program 140 in FIG. 1) may include anOS for controlling resources associated with an electronic device (e.g.,the electronic device 101 in FIG. 1) and/or various applications (e.g.,the application program 147 in FIG. 1) executed on the OS. The OS may beAndroid®, iOS®, Windows®, Symbian®, Tizen®, or Bada.

The programming module 310 includes a kernel 320, middleware 330, an API360, and applications 370. At least a part of the programming module 310may be preloaded on an electronic device or may be downloaded from theelectronic device 102 or 104, or the server 105.

The kernel 320 includes a system resource manager 321 and/or a devicedriver 323. The system resource manager 321 may perform control,allocation, or retrieval of system resources. The system resourcemanager 321 may include a process management unit, a memory managementunit, or a file system management unit. The device driver 323 mayinclude a display driver, a camera driver, a Bluetooth driver, a sharedmemory driver, a USB driver, a keypad driver, a WiFi driver, an audiodriver, and/or an inter-process communication (IPC) driver.

The middleware 330 may provide functions that the applications 370commonly require or provide various functions to the applications 370through the API 360 to allow the applications 370 to efficiently use alimited system resource in an electronic device. The middleware 330(e.g., the middleware 143) includes at least one of a runtime library353, an application manager 341, a window manager 342, a multimediamanager 343, a resource manager 344, a power manager 345, a databasemanager 346, a package manager 347, a connectivity (or connect) manager348, a notification (or inform) manager 349, a location manager 350, agraphic manager 351, or a security manager 352.

The middleware 330 may also include a middleware module forming acombination of various functions of the above-mentioned internalelements. The middleware 330 may provide modules specified according totypes of OS so as to provide distinctive functions. Additionally, themiddleware 330 may delete some of existing elements or add new elementsdynamically.

The API 360 (e.g., the API 145) may be provided as a set of APIprogramming functions with a different configuration according to theOS. In the case of Android® or iOS®, for example, one API set may beprovided by each platform, and in the case of Tizen®, two or more APIsets may be provided.

The applications 370 (e.g., the application program 147) include a homeapplication 371, a dialer application 372, a short messagingservice/multimedia messaging service (SMS/MMS) application 373, aninstant message (IM) application 374, a browser application 375, acamera application 376, an alarm application 377, a contact application378, a voice dial application 379, an e-mail application 380, a calendarapplication 381, a media player application 382, an album application383, and a clock application 384. The applications 370 may include otherapplications, e.g., a health care application (e.g., an application formeasuring an exercise amount or a blood sugar level), or an environmentinformation providing application (e.g., an application for providingair pressure, humidity, or temperature information).

At least a part of the programming module 310 may be implemented bysoftware, firmware, hardware, or a combination of at least two of them.The at least a part of the programming module 310 may be implemented(e.g., executed) by a processor (e.g., the processor 210). The at leasta part of the programming module 310 may include a module, a program, aroutine, sets of instructions, or a process for performing one or morefunctions.

At least a part of a device (for example, modules or functions thereof)or a method (for example, operations) according to an embodiment of thepresent disclosure may be implemented with a command stored in acomputer-readable storage medium in the form of a program module. Whenthe command is executed by a processor (for example, the processor 120),the one or more processors may perform a function corresponding to thecommand. The computer-readable storage medium may be, for example, thememory 130.

Modules or programming modules according to an embodiment of the presentdisclosure may include one or more of the foregoing elements, have someof the foregoing elements omitted, or further include additional otherelements. Operations performed by the modules, the programming modulesor other elements may be executed in a sequential, parallel, repetitiveor heuristic manner. Also, some of the operations may be executed indifferent order or omitted, or may have additional different operations.The embodiments disclosed herein have been provided for description andunderstanding of disclosed technical matters, and do not limit the scopeof the embodiments. Therefore, it should be construed that the scope ofthe embodiments includes any change or other various embodiments basedon the technical spirit of the present document.

FIG. 4 is a schematic view of an electronic device according to anembodiment of the present disclosure.

Referring to FIG. 4, the electronic device 101 includes a housing 1001that forms the exterior of the electronic device 101, and a printedcircuit board (PCB) 1100 included in the housing 1001. On the PCB 1100,electronic components that constitute the functional modules describedabove with reference to FIGS. 1 and 2 may be mounted. A battery 1200 maybe electrically connected to the PCB 1100 via a connecting means. ThePCB 1100 may be a single board, and may include a plurality ofsubstrates 1100-1 and 1100-2 electrically connected to each other.

The electronic device 101 includes a conductive shield (conductiveshield structure) 1300 that covers at least a partial area (a first area(mounting area)) 1101 on the PCB 1100. The conductive shield 1300 maybe, for example, an electromagnetic interference (EMI) shield.

Contact units 1131 and 1132 that are spaced apart from each other areprovided on the PCB 1100. The contact units 1131 and 1132 may beelectrically connected to each other via a cable 1400. The contact units1131 and 1132 may be connectors to which one end and the other end ofthe cable 1400 are electrically connected.

FIG. 5 is a cross-sectional view of the cable according to an embodimentof the present disclosure.

Referring to FIG. 5, the cable 1400 may be a coaxial cable includingconductive lines 1401 and 1402 and insulation layers 1403 and 1404covering the conductive lines 1401 and 1402. However, the scope of thepresent disclosure is not limited by this embodiment. The type of cable1400 is not limited as long as it is an insulated or coated cablecapable of electrically connecting the two contact units 1131 and 1132to each other. At least one conductive line is included, and the numberof conductive lines is not limited.

The electronic device 101 include a first antenna 1501 and a secondantenna 1502 as shown in FIG. 4. For example, the first antenna 1501 maybe an antenna for a cellular network, and the second antenna 1502 may bean antenna for WiFi. The first and second antennas 1501 and 1502 may beconductive antenna structures. For example, the first antenna 1501 andthe second antenna 1502 may be provided on an upper end portion and alower end portion of the electronic device 101, respectively. The cable1400 may connect the first antenna 1501 to the second antenna 1502. Oneof the conductive lines 1401 and 1402 of the cable 1400 may be a groundline. One of the conductive lines 1401 and 1402 of the cable 1400 may beelectrically connected to the first antenna 1501, the second antenna1502, and the communication module 220 of FIG. 2. In FIG. 4, a signalline that connects the conductive lines 1401 and 1402 to thecommunication module 220 may be provided on the PCB 1100. For example,the communication module 220 of FIG. 2 may be provided on the first area1101. The types of antennas and the number of antennas are not limitedto the example of FIG. 4. For example, the electronic device 101 mayfurther include a GPS antenna, an NFC antenna, or a Bluetooth antenna,and at least some of the antennas may be connected to the communicationmodule 220 via the cable 1400.

A support member (support structure) 1600 for fixing the cable 1400, forexample, a clip, may be provided on the PCB 1100. The support member1600 fixes the cable 1400 in cooperation with the conductive shield1300. As illustrated in FIG. 4, a plurality of support members 1600 maybe arranged along a sidewall 1301 of the conductive shield 1300.

FIG. 6 is a perspective view of a structure that fixes the cable byusing a support member and the conductive shield, according to anembodiment of the present disclosure.

FIG. 7 is a sectional view taken along line A-A′ of FIG. 6, according toan embodiment of the present disclosure.

Referring to FIGS. 6 and 7, the support member 1600 may be mounted onthe PCB 1100. The support member 1600 includes a first part 1610 that isspaced apart from a portion of one side (sidewall 1301) of theconductive shield 1300 and is parallel to the sidewall 1301, and asecond part 1620 extending from the first part 1610. The first part 1610is spaced apart from the sidewall 1301 and thus forms a fixing space1630 into which the cable 1400 fits. A width D3 of the fixing space 1630may be slightly less than a thickness (or diameter) of the cable 1400such that the cable 1400 forcibly fits into the fixing space 1630. Inconsideration of the thickness (or diameter) of the cable 1400, a heightof the first part 1610 may be determined so that the cable 1400 is fixedvertically. For example, the first part 1610 includes a fixing portion1640 indented toward the fixing space 1630, in order to fix the cable1400 in a vertical direction. A height H1 of the fixing portion 1640from the PCB 1100 may be, for example, about 0.9 mm. In this case, aheight H2 of the first part 1610 from the PCB 1100 may be, for example,about 1.1 mm. The height H1 of the fixing portion 1640 and the height H2of the first part 1610 are examples, and thus the scope of the presentdisclosure is not limited by the above numerical values.

A horizontal movement of the cable 1400 may be prevented by the firstpart 1610 of the support members 1600 and the sidewall 1301 of theconductive shield 1300. The cable 1400 extends along one side, namely,the sidewall 1301, of the conductive shield 1300 while being fit betweenthe sidewall 1301 of the conductive shield 1300 and the first part 1610of the support member 1600.

The support member 1600 may be surface-mounted on the PCB 1100. Aninstallation strength of the support member 1600 with respect to the PCB1100 depends on the area of the second part 1620. Accordingly, as thesecond part 1620 has a wider area, the installation strength of thesupport member 1600 increases and thus the cable 1400 may be more stablysupported. In addition, an area in which an automated equipment forsurface mounting placement is able to pick up the support member 1600 isrequired for the surface mounting, and the area may be provided by thesecond part 1620.

Referring to FIGS. 6 and 7, the second part 1620 extends from the firstpart 1610 and further extends to the inside of the conductive shield1300 beyond the sidewall 1301 of the conductive shield 1300. To thisend, an aperture 1302 through which the second part 1620 passes may beformed in the sidewall 1301 of the conductive shield 1300. The aperture1302 is indented upwards from an edge 1303 of the sidewall 1301 thatfaces the PCB 1100, namely, in a direction away from the PCB 1100.According to this configuration, the area of the second part 1620 may beincreased without increasing a distance D1 from the conductive shield1300. In other words, while the distance from the conductive shield 1300is maintained to be D1, an installation width D2 may be greater than thedistance D1.

FIG. 8 is a perspective view illustrating a size of the aperture of theconductive shield, according to an embodiment of the present disclosure.

Referring to FIG. 8, a width W of the aperture 1302 is determined inconsideration of, for example, a width of the second part 1620 of thesupport member 1600, prevention of a contact between mounting pads 1180provided on the PCB 1100 to mount the conductive shield 1300 and thesecond part 1620 of the support member 1600, and placement precision ofa surface mounting process. For example, the second part 1620 of thesupport member 1600 may be spaced apart from each of the mounting pads1180 by 0.3 mm or greater. Because the mounting pads 1180 extend up toedges 1302 a and 1302 b of the aperture 1302 in a width direction of theaperture 1302, the second part 1620 of the support member 1600 may bespaced apart from each of the edges 1302 a and 1302 b of the aperture1302 by 0.3 mm or greater. An edge 1302 c (of the aperture 1302 in aheight direction of the aperture 1302 may be spaced apart from thesecond part 1620 of the support member 1600 by 0.25 mm or greater.

In FIG. 8, reference numerals 1620AA and 1620BB indicate mounting padson which the second part 1620 is mounted. For example, reference numeral1620AA indicates a mounting pad for a portion of the second part 1620that is inserted into the aperture 1302, and reference numeral 1620BBindicates a pair of mounting pads for a portion of the second part 1620that is present outside the conductive shield 1300. For example, a widthW1 of the mounting pad 1620AA may be 1.1 mm, a depth D2 thereof may be1.2 mm, and a width W2 of each of the mounting pads 1620BB may be 0.55mm. The mounting pads 1620BB may be located on both sides of themounting pad 1620AA and may be spaced apart from each other by 4.05 mm.In such an exemplary structure, if the second part 1620 has a thicknessof 0.15 mm, the width W of the aperture 1302 is 1.7 mm (=1.1 mm (widthW1 of the mounting pad 1620AA)+0.3 mm+0.3 mm) or greater, and the heightH thereof is 0.4 mm (=0.15 mm (thickness of the second part 1620)+0.25mm) or greater. The width W and the height H of the aperture 1302 areexamples, and the scope of the present disclosure is not limited by theabove numerical values.

FIG. 9 is a partial plan view of the first area of the PCB, according toan embodiment of the present disclosure.

FIG. 10 is a cross-sectional view taken along line B-B′ in FIG. 9,according to an embodiment of the present disclosure.

Referring to FIGS. 9 and 10, the PCB 1100 includes a first surface 1102,a second surface 1103, which is opposite the first surface 1102, and alateral surface 1123 that connects the first surface 1102 to the secondsurface 1103. At least one conductive layer may be interposed betweenthe first surface 1102 and the second surface 1103. According to anembodiment of the present disclosure, two conductive layers 1104 and1105 are provided between the first surface 1102 and the second surface1103, and an insulation layer 1106 is interposed between the conductivelayers 1104 and 1105. The conductive layers 1104 and 1105 include aplurality of lands 1107 and a plurality of lands 1108, respectively,separated from each other by the insulation layer 1106. The lands 1107and 1108 of the conductive layers 1104 and 1105 are electricallyconnected to each other by via holes 1109 and thus form an electriccircuit, as necessary. The conductive layers 1104 and 1105 form aground. The conductive layers 1104 and 1105 may also form a signal line1116.

The first area 1101, on which electronic components 1190 are mounted, isprovided on the first surface 1102. The electronic components 1190 areomitted in FIG. 10. The first surface 1102 may be implemented by aninsulation layer 1110 located on an upper surface of the conductivelayer 1104. The insulation layer 1110 may include a plurality ofapertures via which the conductive layer 1104 is exposed. Accordingly,the first surface 1102 includes the conductive layer 1104 and anon-conductive layer (the insulation layer 1110).

The apertures include a first aperture 1111 extending along an edge ofthe first area 1101, and a second aperture 1112 extending from a portionof the edge of the first area 1101 to outside the first area 1101. Thefirst aperture 1111 surrounds the first area 1101. A planar shape of thefirst aperture 1111 is open. The second aperture 1112 is adjacent to andspaced apart from the first aperture 1111. Although the first aperture1111 is illustrated as a single long opening in FIG. 9, the firstaperture 1111 may be implemented by a plurality of apertures arrangedalong the edge of the first area 1101. The first aperture 1111 may befilled with a first conductive material 1113. The second aperture 1112may be filled with a second conductive material 1114. Accordingly, thefirst and second conductive materials 1113 and 1114 are electricallyconnected to the conductive layer 1104.

The conductive shield 1300 covers the first area 1101 and the electroniccomponents 1190, as viewed from above the first surface 1102 of the PCB1100. The conductive shield 1300 contacts the first conductive material1113. For example, the conductive shield 1300 includes a mounted portion1312 which is supported by the PCB 1100, and the mounted portion 1312may extend from the sidewall 1301 along the first surface 1102. Themounted portion 1312 contacts the first conductive material 1113. Thefirst conductive material 1113 may be an electrical solder material.Accordingly, the conductive shield 1300 is surface-mounted on the PCB1100.

The support member 1600 includes the first part 1610 and the second part1620. The first part 1610 extends substantially perpendicular to thefirst surface 1102 and faces a portion of the sidewall 1301 of theconductive shield 1300 at a certain distance as viewed from above thefirst surface 1102 of the PCB 1100. The second part 1620 extends fromthe first part 1610 along the first surface 1102. The support member1600 contacts the second conductive material 1114. For example, theaperture 1302 may form a hole into which the second part 1620 isinserted, between the second aperture 1112 and a portion of the sidewall1301. The second part 1620 of the support member 1600 is inserted intothe hole (aperture 1302) formed between the sidewall 1301 and the secondaperture 1112 and is seated on the second conductive material 1114provided in the second aperture 1112. Accordingly, the support member1600 contacts the second conductive material 1114. The second conductivematerial 1114 may be an electrical solder material. Accordingly, thesupport member 1600 may be surface-mounted on the PCB 1100.

FIG. 11 schematically illustrates a surface mounting method according toan embodiment of the present disclosure.

Referring to FIG. 11, the PCB 1100 including the first and secondapertures 1111 and 1112 and the first area 1101 for mounting theelectronic components 1190 thereon is prepared (operation 1). Aplurality of pads on which electronic components are to be mounted areprovided on the first area 1101. The second aperture 1112 extendsinwards from an extension of the first aperture 1111, namely, inwardstoward the first area 1101. An electrical solder material may be coatedon the first and second apertures 1111 and 1112 and the pads on whichthe electronic components 1190 are to be mounted.

The electronic components 1190 are mounted on the first area 1101, andthe support member 1600 is mounted on the second aperture 1112(operation 2).

The conductive shield 1300 is mounted on the first aperture 1111. Then,the first part 1610 of the support member 1600 and the sidewall 1301 ofthe conductive shield 1300 are spaced apart from each other, and thusthe fixing space 1630 in which the cable 1400 is fixed is formed betweenthe first part 1610 and the sidewall 1301. The second part 1620 of thesupport member 1600 extends inwards from an extension of the sidewall1301 of the conductive shield 1300, namely, inwards towards the firstarea 1101 (operation 3).

The cable 1400 is fit into the fixing space 1630, and both ends of thecable 1400 are connected to the contact units 1131 and 1132,respectively. In operation 4, the cable 1400 extends along the sidewall1301 of the conductive shield 1300 as viewed from above the firstsurface 1102 of the PCB 1100, and is inserted between the first part1610 of the support member 1600 and a portion of the sidewall 1301 ofthe conductive shield 1300.

A plurality of mounting areas may be included. A plurality of conductiveshields (conductive shield structures) that respectively cover theplurality of mounting areas may be included.

FIG. 12 is a schematic view of an electronic device according to anembodiment of the present disclosure.

FIG. 12 illustrates three mounting areas, namely, first, second, andthird areas 1101 a, 1101 b, and 1101 c, and first, second, and thirdconductive shields 1300 a, 1300 b, and 1300 c respectively covering thefirst, second, and third areas 1101 a, 1101 b, and 1101 c. Theelectronic components 1190 of FIG. 9 may be mounted on the first,second, and third areas 1101 a, 1101 b, and 1101 c, respectively. First,second, and third support members 1600 a, 1600 b, and 1600 c may bearranged in correspondence with the first, second, and third conductiveshields 1300 a, 1300 b, and 1300 c, respectively. The shapes of thefirst, second, and third conductive shields 1300 a, 1300 b, and 1300 cand a method of mounting the same on the PCB 1100 may be the same asthose for the conductive shield 1300 described above with reference toFIGS. 9-11. The shapes of the first, second, and third support members1600 a, 1600 b, and 1600 c may be the same as that of the support member1600 shown in FIGS. 6 and 7, and a method of mounting the first, second,and third support members 1600 a, 1600 b, and 1600 c on the PCB 1100 maybe the same as the method of mounting the support member 1600 describedabove with reference to FIGS. 9-11. The number of conductive shields isnot limited to three. In addition, multiple support members may bearranged on a single conductive shield, and at least two supports may bearranged on a single conductive shield.

Due to the arrangement of a plurality of support members along sidewallsof a plurality of conductive shields, the cable 1400 may be stablysupported.

Although an integrated conductive shield has been illustrated in theabove-described embodiments, the scope of the present disclosure is notlimited by these embodiments. For example, a conductive shield may beimplemented by a shield frame and shield cover that is coupled orattached to the shield frame.

FIG. 13 is a partially exploded perspective view of a conductive shieldaccording to an embodiment of the present disclosure.

Referring to FIG. 13, the conductive shield 1300 includes a shield frame1310 mounted on the PCB 1100, and a shield cover 1320 coupled to theshield frame 1310. The shield frame 1310 includes a first sidewall 1311extending along an edge of the first area 1101 and a mounted portion1312 extending from the first sidewall 1311 along the first surface 1102of the PCB 1100. The mounted portion 1312 may be mounted on the firstaperture 1111 of FIGS. 9 and 10 via, for example, soldering. The firstsidewall 1311 may surround the first area 1101. A first aperture 1313 isformed in the first sidewall 1311 such that the second part 1620 of thesupport member 1600 may extend inwards an extension of the firstsidewall 1311, namely, inwards the first area 1101.

The shield cover 1320 may include an upper wall 1321 covering the top ofthe first area 1101, and a second sidewall 1322 extending from the upperwall 1321 and covering at least a portion of the first sidewall 1311 ofthe shield frame 1310. A second aperture 1323 is formed at a locationcorresponding to the first aperture 1313 of the second sidewall 1322.

The shield cover 1320 is coupled to the shield frame 1310. For example,the shield cover 1320 may be coupled to the shield cover 1310 via asnap-fit coupling structure.

FIG. 14 is a cross-sectional view taken along line C-C′ of FIG. 13,according to an embodiment of the present disclosure.

Referring to FIGS. 13 and 14, a plurality of coupling protrusions 1314are formed on the first sidewall 1311 of the shield frame 1310. Aplurality of coupling grooves 1324 are formed on the second sidewall1322 of the shield cover 1320. When the shield cover 1320 is coupled tothe shield frame 1310 from above, the second sidewall 1322 iselastically slightly opened outwards, and simultaneously the couplingprotrusions 1314 are inserted into the plurality of coupling grooves1324, and the second sidewall 1322 is elastically returned toward thefirst sidewall 1311. Accordingly, the shield cover 1320 is coupled tothe shield frame 1310. The second sidewall 1322 includes a plurality ofslits 1325 splitting the second sidewall 1322 into a plurality of areas,so that, when the shield cover 1320 is coupled to the shield frame 1310,the second sidewall 1322 is easily opened outwards. The plurality ofslits 1325 are located between the plurality of coupling grooves 1324.

In FIG. 13, the aperture 1302 of FIGS. 4-11 is implemented by the firstand second apertures 1313 and 1323 respectively formed in the first andsecond sidewalls 1311 and 1322.

The first and second apertures 1313 and 1323 completely open the firstand second sidewalls 1311 and 1322 of the shield frame 1310 and theshield cover 1320. However, the scope of the present disclosure is notlimited thereto.

FIG. 15 is a partially exploded perspective view of a conductive shieldaccording to an embodiment of the present disclosure.

Referring to FIG. 15, the aperture 1302 of FIG. 6, allowing the secondpart 1620 of the support member 1600 to extend beyond the first andsecond sidewalls 1311 and 1322 and into the first area 1101, may beimplemented by first and second apertures 1313 and 1323 partiallyindented from edges of the first and second sidewalls 1311 and 1323facing the first surface 1102 of the PCB 1100 in an upwards directionaway from the PCB 1100.

A combination of the first aperture 1313 of FIG. 13 completely openingthe sidewall 1311 and the second aperture 1323 of FIG. 15 partiallyopening the second sidewall 1322 is possible, or a combination of thefirst aperture 1313 of FIG. 15 partially opening the first sidewall 1311and the second aperture 1323 of FIG. 13 partially opening the secondsidewall 1322 is possible.

A method of coupling the shield cover 1320 to the shield frame 1310 isnot limited to the above-described snap-fit coupling structure. Forexample, the shield cover 1320 may be joined to the shield frame 1310 byscrews. Alternatively, the shield cover 1320 may be joined to the shieldframe 1310 via adhesion.

FIG. 16 is a partially exploded perspective view of a conductive shieldaccording to an embodiment of the present disclosure.

Referring to FIG. 16, the conductive shield 1300 includes a shield frame1330 mounted on the PCB 1100, and a shield cover 1340 attached to theshield frame 1330. The shield frame 1330 includes a sidewall 1331extending along an edge of the first area 1101 and a mounted portion1332 extending from the sidewall 1331 along the first surface 1102 ofthe PCB 1100. The mounted portion 1332 may be mounted on the firstaperture 1111 of FIGS. 9 and 10 via, for example, soldering. Thesidewall 1331 surrounds the first area 1101. An aperture 1333 is formedin the sidewall 1331 such that the second part 1620 of the supportmember 1600 may extend beyond the sidewall 1331 inwards the first area1101. An attachment portion 1334 is provided on an upper end of thesidewall 1331, namely, on an end of the sidewall 1331 opposite to thePCB 1100. The attachment portion 1334 denotes a surface to which theshield cover 1340 is attached.

The shield cover 1340 covers the top of the mounting area 1101. Theshield cover 1340 may be attached to the attachment portion 1334 by, forexample, a double-sided adhesive tape.

FIG. 17 schematically illustrates a surface mounting method when each ofthe conductive shields of FIGS. 13-16 is used, according to anembodiment of the present disclosure.

Referring to FIG. 17, the PCB 1100 including the first and secondapertures 1111 and 1112 and the first area 1101 for mounting theelectronic components 1190 thereon is prepared. A plurality of pads onwhich electronic components are to be mounted are provided on the firstarea 1101. The second aperture 1112 extends beyond the first aperture1111 inwards towards the first area 1101. An electrical solder materialis coated on the first and second apertures 1111 and 1112 and the padson which the electronic components 1190 are to be mounted (operation 1).

The electronic components 1190 are mounted on the first area 1101, andthe support member 1600 is mounted on the second aperture 1112(operation 2).

The conductive shield 1300 is mounted on the first aperture 1111. Tothis end, the shield frame 1310 or 1330 is mounted on the first aperture1111 (operation 3). The shield cover 1320 or 1340 is coupled or attachedto the shield frame 1310 or 1330 (operation 4). Then, the first part1610 of the support member 1600 and the sidewall 1301 of the conductiveshield 1300 are spaced apart from each other, and thus the fixing space1630 in which the cable 1400 is fixed is formed between the first part1610 and the sidewall 1301. The second part 1620 of the support member1600 extends beyond the sidewall 1301 of the conductive shield 1300inwards towards the mounting area 1101.

The cable 1400 is fit into the fixing space 1630.

In a modification of the electronic device 101 of FIG. 12, a supportmember may be disposed on a boundary between two adjacent conductiveshields.

FIG. 18 is a perspective view of a structure for fixing a cable by usinga support member and a conductive shield, according to an embodiment ofthe present disclosure.

Referring to FIG. 18, two adjacent conductive shields, namely, the firstand second conductive shields 1300 a and 1300 b, are mounted on the PCB1100. The first and second conductive shields 1300 a and 1300 brespectively cover the first and second areas 1101 a and 1101 b of FIG.12, on which the electronic components 1190 of FIG. 9 are mounted. Thefirst part 1610 of the support member 1600 is arranged apart fromportions of respective arranged sides of the first and second conductiveshields 1300 a and 1300 b, namely, sidewalls 1301-1 and 1301-2, whilefacing portions of the sidewalls 1301-1 and 1301-2. In this case,apertures 1302-1 and 1302-2 are formed in the sidewalls 1301-1 and1301-2 so that the second part 1620 of the support member 1600 mayextend inwards towards the first and second conductive shields 1300 aand 1300 b. The cable 1400 is fit between the sidewalls 1301-1 and1301-2 and the first part 1610 and extends along the sidewalls 1301-1and 1301-2.

The support member 1600 may be disposed on a boundary between the secondand third conductive shields 1300 b and 1300 c in FIG. 12.

Although the support members 1600 are supported by the first surface1102 of the PCB 1100 in the above-described embodiments, the scope ofthe present disclosure is not limited thereto. The support members 1600may be supported by at least one of the first surface 1102, the secondsurface 1103, and the lateral surface 1123 of the PCB 1100.

FIG. 19 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according to anembodiment of the present disclosure.

Referring to FIG. 19, two mounting areas for the electronic components1190 of FIG. 9 are respectively provided on the first surface 1102 andthe second surface 1103 of the PCB 1100, and the conductive shields1300-3 and 1300-4 respectively cover the two mounting areas. Supportmembers 1600-1 and 1600-2 are disposed on the first surface 1102 and thesecond surface 1103, respectively. The support members 1600-1 and 1600-2include first parts 1610 respectively spaced apart from sidewalls 1301-3and 1301-4. A pair of cables 1400-1 and 1400-2 are respectively disposedon the first surface 1102 and the second surface 1103 of the PCB 1100,and are respectively fixed between the sidewall 1301-3 of the conductiveshield 1300-3 and the first part 1610 of the support member 1600-1 andbetween the sidewall 1301-4 of the conductive shield 1300-4 and thefirst part 1610 of the support member 1600-2. Apertures 1302-3 and1302-4, through which the second parts 1620 of the support members1600-1 and 1600-2 pass, are formed in the sidewalls 1301-3 and 1301-4 ofthe conductive shields 1300-3 and 1300-4.

FIG. 20 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according to anembodiment of the present disclosure.

Referring to FIG. 20, two mounting areas for the electronic components1190 of FIG. 9 are respectively provided on the first surface 1102 andthe second surface 1103 of the PCB 1100, and the conductive shields1300-3 and 1300-4 respectively cover the two mounting areas.

A support member 1600-3 is supported by the first surface 1102, thesecond surface 1103, and the lateral surface 1123 of the PCB 1100. Thesupport member 1600-3 includes a pair of first parts 1610 a and 1610 band a second part 1620 supported by the PCB 1100. The first parts 1610 aand 1610 b are spaced apart from the sidewalls 1301-3 and 1301-4,respectively. The second part 1620 includes portions 1620 a and 1620 brespectively extending from the first parts 1610 a and 1610 b andsupported by the first surface 1102 and the second surface 1103, and aportion 1620 c connecting the portions 1620 a and 1620 b and supportedby the lateral surface 1123. The portion 1620 a, the portion 1620 c, andthe portion 1620 b form a “

” shape, and thus surround the first surface 1102, the lateral surface1123, and the second surface 1103 of the PCB 1100.

The PCB 1100 is fit into the “

” shape formed by the portion 1620 a, the portion 1620 c, and theportion 1620 b, and thus the support member 1600-3 is fixed to the PCB1100.

The support member 1600-3 may be bonded to the PCB 1100 while the PCB1100 is fit into the “

” shape formed by the portion 1620 a, the portion 1620 c, and theportion 1620 b.

The support member 1600-3 is surface-mounted on the PCB 1100 while thePCB 1100 is fit into the “

” shape formed by the portion 1620 a, the portion 1620 c, and theportion 1620 b. For example, after an electrical solder material iscoated on mounting pads on the PCB 1100 and the PCB 1100 is fit into the“

” shape formed by the portion 1620 a, the portion 1620 c, and theportion 1620 b, the resultant structure is heated and thus the secondpart 1620 is fixed to the mounting pads by the electrical soldermaterial.

Apertures 1302-3 and 1302-4, through which the portions 1620 a and 1620b of the support member 1600-3 pass, are respectively formed in thesidewalls 1301-3 and 1301-4 of the conductive shields 1300-3 and 1300-4.A pair of cables 1400-1 and 1400-2 are respectively disposed on thefirst surface 1102 and the second surface 1103 of the PCB 1100, and arerespectively fixed between the sidewall 1301-3 of the conductive shield1300-3 and the first part 1610 a of the support members 1600-3 andbetween the sidewall 1301-4 of the conductive shield 1300-4 and thefirst part 1610 b of the conductive shield 1600-3.

FIG. 21 is a schematic cross-sectional view of a structure for fixing acable by using a support member and a conductive shield, according to anembodiment of the present disclosure.

Referring to FIG. 21, a flat plane portion 1406 is provided on at leasta portion of an outer circumference of the cable 1400. A cable 1400-3 isinserted between the first part 1610 and the sidewall 1301 such that theplane portion 1406 faces the sidewall 1301. The plane portion 1406blocks the aperture 1302. Accordingly, at least a portion of theaperture 1302 is blocked, leading to a reduction in the amount ofelectromagnetic energy emitted via the aperture 1302.

FIG. 22 is a schematic cross-sectional view of a cable 1400-3 accordingto an embodiment of the present disclosure.

Referring to FIG. 22, an external insulation layer 1404 covering anexternal conductive line 1402 of the cable 1400-3 is partially removed,and thus the external conductive line 1402 is exposed via the planeportion 1406. When the cable 1400-3 is inserted between the first part1610 and the sidewall 1301 such that the plane portion 1406 faces thesidewall 1301, a portion of the external conductive line 1402 exposedvia the plane portion 1406 contacts the sidewall 1301. The externalconductive line 1402 may be a ground line. Accordingly, the externalconductive line 1402 is electrically connected to the conductive layers1104 and/or 1105 of FIG. 10, which form a ground, via the sidewall 1301and the first conductive material 1113 of FIG. 10, as necessary.

Although each support member 1600 includes one first part 1610 and onesecond part 1620 in the above-described embodiments, the support member1600 may include at least two first parts 1610. FIG. 23 is aschematically perspective view of a support 1600-4 according to anembodiment. Referring to FIG. 23, the support member 1600-4 includes twofirst parts 1610 and a second part 1620 connected to the two first parts1610.

The support members 1600 of FIG. 4, at least one of the support members1600 a, 1600 b, and 1600 c of FIG. 12, and at least one of the supportmembers 1600-1 and 1600-2 of FIG. 19 may be substituted by the supportmembers 1600-4 of FIG. 23.

The number of first parts 1610 may be at least three. As necessary, thenumber of second parts 1620 may be at least two.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While certain embodiments have been described with reference to thedrawings, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the present disclosure, asdefined by the following claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a housing; aprinted circuit board (PCB) included in the housing, and comprising afirst surface, a second surface on a side of the PCB opposite to thefirst surface, a lateral surface, a non-conductive layer forming atleast a portion of the first surface, and a conductive layer arrangedbetween the first surface and the second surface; a first electroniccomponent arranged on a first area of the first surface of the PCB; afirst conductive shield structure arranged on the PCB to cover the firstarea and the first electronic component on the PCB; a support structureconnected to the PCB comprising a first part that extends substantiallyperpendicular to the first surface and faces a portion of one side ofthe first conductive shield structure; and a cable extending along theone side of the first conductive shield structure, inserted between thesupport structure and the portion of the one side of the firstconductive shield structure, and comprising at least one conductive lineand an insulation layer that covers the at least one conductive line. 2.The electronic device of claim 1, wherein the non-conductive layercomprises: a first aperture extending along an edge of the first areaand filled with a first conductive material; and a second apertureextending from a portion of the edge of the first area to outside thefirst area and filled with a second conductive material, wherein thefirst conductive shield structure contacts the first conductivematerial, and the support structure contacts the second conductivematerial.
 3. The electronic device of claim 2, wherein the secondaperture is adjacent to and spaced apart from the first aperture.
 4. Theelectronic device of claim 2, wherein the first conductive material andthe second conductive material comprise an electrical solder material.5. The electronic device of claim 2, wherein the first conductivematerial and the second conductive material are electrically connectedto the conductive layer.
 6. The electronic device of claim 2, whereinthe first conductive shield structure comprises a sidewall, and thesupport structure further comprises a second part inserted into a holeformed between the second aperture and a portion of the sidewall.
 7. Theelectronic device of claim 1, wherein the support structure is connectedto at least one of the first surface, the second surface, and thelateral surface of the PCB.
 8. The electronic device of claim 1, furthercomprising: a conductive antenna structure; and a wireless communicationcircuit, wherein the at least one conductive line is electricallyconnected to the conductive antenna structure and the wirelesscommunication circuit.
 9. The electronic device of claim 1, furthercomprising: a second electronic component arranged on a second area ofthe first surface of the PCB that is adjacent to the first area; and asecond conductive shield structure arranged on the PCB to cover thesecond area and the second electronic component on the PCB, wherein thefirst part of the support structure faces a portion of one side of thesecond conductive shield structure.
 10. An electronic device comprising:a housing; a printed circuit board (PCB) included in the housing, andcomprising a first surface, a second surface opposite to the firstsurface, a lateral surface, a non-conductive layer forming at least aportion of the first surface, and a conductive layer arranged betweenthe first surface and the second surface; an electronic componentarranged on a first area and a second area of the first surface of thePCB, wherein the first area and the second area are arranged side byside; first and second conductive shield structures arranged on the PCBto respectively cover the first area and the second area on the PCB; asupport structure connected to the PCB, and comprising a first part thatextends substantially perpendicular to the first surface and facesportions of respective arranged sides of the first and second conductiveshields; and a cable extending along the arranged sides of the first andsecond conductive shield structures, inserted between the supportstructure and the portions of the arranged sides of the first and secondconductive shield structures, and comprising at least one conductiveline and an insulation layer that covers the at least one conductiveline.
 11. The electronic device of claim 10, wherein the first andsecond conductive shield structures comprise sidewalls, and the supportstructure further comprises a second part inserted into apertures in therespective sidewalls of the first and second conductive shieldstructures.
 12. An electronic device comprising: a housing; a printedcircuit board (PCB) included in the housing and comprising a mountingarea on which an electronic component is mounted, and a pair of contactunits; a conductive shield mounted on the PCB to cover the mounting areaand comprising a sidewall and an aperture that partially opens thesidewall; a support member comprising a first part spaced apart from thesidewall and mounted on the PCB; and a cable configured to electricallyconnect the pair of contact units to each other and to be insertedbetween the sidewall and the first part.
 13. The electronic device ofclaim 12, wherein the support member further comprises a second partthat extends from the first part, passes through the aperture of thesidewall, extends into the mounting area, and is surface-mounted on thePCB.
 14. The electronic device of claim 12, wherein the cable comprisesa plane portion that is flat and faces the sidewall, and the planeportion covers at least a portion of the aperture.
 15. The electronicdevice of claim 14, wherein the cable comprises a conductive line and aninsulation layer that covers the conductive line, and the conductiveline is exposed and contacts the sidewall.
 16. The electronic device ofclaim 13, wherein the mounting area comprises a plurality of mountingareas, the conductive shield comprises a plurality of conductive shieldsthat respectively cover the plurality of mounting areas, and the supportmember comprises a plurality of support members respectivelycorresponding to the plurality of conductive shields.
 17. The electronicdevice of claim 13, wherein the mounting area comprises a plurality ofmounting areas, the conductive shield comprises a plurality ofconductive shields that respectively cover the plurality of mountingareas, the support member is arranged to partially face each ofrespective arranged sidewalls of two adjacent conductive shields amongthe plurality of conductive shields, and the aperture is formed in eachof the two adjacent conductive shields.
 18. The electronic device ofclaim 13, wherein the conductive shield comprises a shield frame thatsurrounds the mounting area and is surface-mounted on the PCB, and ashield cover that is coupled to the shield frame and covers the mountingarea.
 19. The electronic device of claim 18, wherein the shield framecomprises a first sidewall that surrounds the mounting area, the shieldcover comprises a cover portion that covers the mounting area, and asecond sidewall that extends from the cover portion, and a firstaperture and a second aperture are respectively provided in the firstsidewall and the second sidewall.
 20. The electronic device of claim 19,wherein the shield cover is coupled to the shield frame according to asnap-fit coupling structure.
 21. The electronic device of claim 20,wherein a plurality of coupling protrusions are provided on the firstsidewall, and a plurality of coupling grooves, into which the pluralityof coupling protrusions are inserted, are provided on the secondsidewall.
 22. The electronic device of claim 21, wherein slits thatsplit the second sidewall into a plurality of areas are provided betweenthe plurality of coupling grooves of the second sidewall.
 23. Theelectronic device of claim 18, wherein the shield frame comprises afirst sidewall that surrounds the mounting area, and an attachmentportion provided on an upper end of the first sidewall, and the shieldcover contacts the attachment portion.
 24. The electronic device ofclaim 23, wherein the aperture is in the first sidewall.
 25. Theelectronic device of claim 12, further comprising: a conductive antenna;a wireless communication module, wherein the cable electrically connectsthe conductive antenna to the wireless communication module.